PCB sled evaluation jig

Main applications

TH230TH series PCB warpage evaluation jig based on JIS C5101

Board warp evaluation jig Customized

Tip push R shape, distance between substrate support fulcrums, etc.

microhead

The microhead accurately measures the amount of board warpage and can also accommodate various board thicknesses with the use of spacers.

Standard price and delivery date TH-230 Catalog

Delivery time: about 15 days